Qianyi has supplied micron-grade powders to the semiconductor, piezoelectric crystal, crystal ceramic, magnetic material, precision ceramic, special metal and optical material industries since 2012. Find your process below, then open the material.
Each block lists the materials we would normally propose, with the figures that matter for that process.
Send the workpiece material, the finish you need and your current abrasive. Technical support (Mr. Cai Feng, +86 158 3827 8887) will propose a grade and grit band, and we can produce a custom size if nothing standard fits.
| If you are working on… | Start with | Why |
|---|---|---|
| Silicon wafers, GaAs, InP | PWA + WFA micropowder | Platelets slide parallel to the wafer, so surfaces stay scratch-free; yield generally holds above 96%. |
| Slicing solar / semiconductor wafers | GC800#–GC10000# | Green silicon carbide is harder than corundum and mechanically stronger — it cuts hard, brittle stock. |
| Piezoelectric quartz crystals | PWA + WFA 240#/280# | Narrow particle distribution and clean grain surfaces control both finish and frequency accuracy. |
| LCD substrates, optical glass | PWA + GC | Tabular alumina cuts at least 10–20% of lapping and polishing passes while keeping surfaces mirror-flat. |
| Stainless steel mirror polishing | WFA micropowder | Over 99% α-phase, high hardness and strong cutting power with excellent chemical stability. |
| Refractories, castables, bricks | BFA F4–F320 | Tougher than silicon carbide, with small crystal size and good impact resistance. |
| Sandblasting profiles and moulds | BFA | No free silica, high bulk density and good toughness — an environment-friendly blasting media. |
| Grinding wheels, discs, coated abrasives | WFA / GC / BFA | Grain shape and edge retention matched to resin, vitrified and coated bonding systems. |
Because tabular alumina is flat rather than equiaxed, grinding pressure spreads evenly across the platelet face. Grain fracture drops, wear resistance rises sharply, and the abrasive slides rather than rolls across the wafer.
The practical result: fewer random scratches, a 10–15% improvement in pass rate against conventional abrasives, and semiconductor wafer yields that generally stay above 96%. Platelets are also near-transparent with nano-scale thickness and micron-scale diameter, giving both nano and micron powder behaviour in one material.
Tell us the workpiece, target finish, current abrasive and monthly volume. We will come back with a recommended material, grit band and grading standard.
